p a n a s o n i c s e m i c o n d u c t o r s i n g a p o r e a d i v i s i o n o f p a n a s o n i c s e m i c o n d u c t o r a s i a p t e l t d c o m p a n y r e g i s t r a t i o n n o . 1 9 7 8 0 3 1 2 5 e 2 2 , a n g m o k i o i n d u s t r i a l p a r k 2 , s i n g a p o r e 5 6 9 5 0 6 . t e l : ( 6 5 ) 6 4 8 1 8 8 1 1 f a x : ( 6 5 ) 6 4 8 1 6 4 8 6 n o t e : t h i s c o v e r p a g e e s t a b l i s h e s t h e d o c n o . , t i t l e a n d c u r r e n t s t a t u s o f t h e a t t a c h e d d o c u m e n t . r e v i s i o n h i s t o r y f m s c - g e n - m 1 - 0 1 d o c u m e n t c o v e r p a g e a m e n d e d o u t e r l e a d s u r f a c e p r o c e s s & r e m a r k s c h a n g e d e t a i l s p a g e s / n e f f d a t e r e v i s s u e e f f d a t e r e v i s s u e l e v e l s d s c - p s e - a n 8 0 t 0 5 d o c n o . d o c t i t l e p r o d u c t s p e c i f i c a t i o n s f o r a n 8 0 t 0 5 t o t a l n o . o f p a g e s ( e x c l u d i n g t h i s p a g e ) 1 1 1 2 1 - m a r - 0 5 4 a d d e d t h i s c o v e r p a g e . - 1 r e m o v e d t h i s p a g e . 3 9 a 4 9 r e m o v e d p h y s i c a l p r o d u c t m a r k i n g i n d i c a t i o n s . 4 2 1 - m a r - 0 5 8 1 a d d e d t h i s p a g e f o r l e a d f r e e s p e c i f i c a t i o n . 9 a 2 c h i p m o u n t i n g m e t h o d . 1 6 - d e c - 0 4 3 1
21-mar-05 product specifications semiconductor company, matsushita electric industrial co., ltd. fmsc-psda-002-01 rev 1 prepared checked approved eff. date eff. date eff. date eff. date AN80T05 ref no. total page page no. e 11 8 package name unit : mm fp-12s 29.96 0.3 28.0 0.3 20.00.1 0.6 6.4 0.3 ? 3.6 7.7 0.3 7.8 0.3 0.6 0.1 2.54 3.5 0.3 0.25 +0.1 -0.05 1.2 0.1 r1.8 1 12 29.6 0.3 lim fuey sheen kenneth law yasuo higuchi 12-sil(fp) *4
chip surface passivation lead frame material inner lead surface process outer lead surface process chip mounting method wire bonding method wire material mold material molding method fin material sin, fe group, ag plating, solder plating (98sn-2bi), ag paste, thermalsonic bonding, au, epoxy, transfer mold, cu group, others ( ) others ( ) others ( ) others ( ) others ( ) others ( ) others ( ) others ( ) others ( ) 1 2 , 6 psg, cu group, au plating, solder dip, multiplunger mold, 2 6 3 4 4 5 5 product specifications semiconductor company, matsushita electric industrial co., ltd. fmsc-psda-002-01 rev 1 prepared checked approved eff. date eff. date eff. date eff. date ref no. total page page no. f 11 9a (structure description) package fp-12s AN80T05 - 6 5 7 7 1 4 2 3 lim fuey sheen kenneth law yasuo higuchi *3 (leadfree) solder (95.5pb-2.5ag-2sn)** au-si alloy, 16-dec-04 *3 **under rohs exemption clause, lead (pb) in high melting temperature type solder (i.e. tin-lead solder alloys containing more than 85% of lead), is exempted until 2010. *3 - -
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